Timing predictions aside, multi-chip designs with 3D stacking will be the path forward
3D chiplets will be the key to building the world's first one-trillion transistor GPU, says TSMC chairman Mark Liu and chief scientist H.-S. Philip Wong.
While newer nodes with increased transistor density will be an important part in getting to one trillion transistors, it's not enough on its own. Instead, Liu and Wong say 3D chiplets, the cutting-edge technology of connecting several chips together beside and on top of each other, are going to be crucial for achieving one trillion transistors.
Not only can chiplets break beyond the reticule limit , but the approach can also reduce manufacturing costs, especially if individual chiplets are on the smaller side.
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